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Value Propositions
for Metallization in 5 Key Areas:

1. Fine Lines and Spaces (<25um), ultra-thin metal (down to 0.1 um): Rigid/flex PCB
2. Via Excellence: Efficient via plating; selective via plating
3. Nano-alloys: Elliminate hexavalent chromium, zincate, electroless Ni
4. Fiber Metalization: Low cost, simple process for polymers, carbon fibers
5. Circuit Metalization of the interior and exterior of 3D printed parts

Customer Benefits

• Additive metallization, no adhesives, no tie coats
• Significantly cleaner and lower cost than conventional alternatives
• Eliminates numerous conventional/alternative process steps
• Less metal, less water, lower cost (25% to 75% less)