Manufacturing Processes

A very high density manufacturing process for circuit boards with metal traces as narrow as 15 microns.

An ultra high density manufacturing process for circuit boards with metal traces as narrow as 5 microns and embedded devices.

RF and millimeter wave passive devices including RF Waveguides.

Ultra thin, ultra conformal, pure metal layers on a variety of materials that allow the underlying material to retain its texture, feel and drape while benefiting from the thermal and electrical conductivity properties of metal.